Technomelt is widely recognized as an industry leader in low-pressure molding compounds.
These thermoplastic hotmelts use extremely low pressure to effectively encapsulate even the most delicate circuitry. Technomelt cycle time is fast and processing temperatures are a modest 130 to 240°C, with in-use temperatures ranging from –40 to +140°C. As compared to traditional potting and encapsulating processes, Technomelt is superior, offering short cycle times, low-pressure molding and maximum yield with minimal material waste, without damaging delicate circuitry.
Technomelt low-pressure molding occupies the niche between injection molding and potting. It is basically injection molding at very low pressures with hotmelt adhesives. The process is fast, simple and clean: just insert electronics, overmold, and test.